MEMS + electroplating "to realize" sandwich "three-dimensional microstructure

According to Macs consulting, Japan's Onoda Manufacturing Institute and the precision electronic Aviation Technology Department of Nagano County Industrial Technology Center recently announced that they have jointly developed a composite three-dimensional microstructure combining metal materials and resin materials, which can be used to manufacture extremely small sensors and electronic devices.

The project takes advantage of the technical advantages of both parties and is developed based on innovative MEMS technology. Among them, Onoda Manufacturing Institute provides electroplating technology with excellent mechanical strength and electrical characteristics, and Nagano Industrial Technology Center provides MEMS process and evaluation technology.

Using this technology, the complex microstructure of curve or small concave convex can be made with the machining accuracy of 0.01mm or less. At the same time, the manufacturing process of conductive metal material layer is optimized to achieve good mechanical strength and electrical properties. In addition, by using the "sandwich" structure of metal insulating material metal, the two layers of metal materials are successfully bonded together through insulating materials. The manufacturing of this three-dimensional microstructure adopts the combination of lithography and electroplating technology in MEMS manufacturing, which can effectively reduce the manufacturing cost after large-scale mass production.

This innovative technology can be used in the development of micro sensors and electronic devices, greatly reducing the size of new products to less than one tenth of the original technical scheme. Onoda production Institute and Nagano County Industrial Technology Center have begun to plan to provide entrusted processing services.